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في الرقميات والتكنولوجيا
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REALME C65 8/128
Network Technology GSM / HSPA / LTE Launch Announced 2024, April 02 Status Available. Released 2024, April Body Dimensions 164.6 x 76.1 x 7.6 mm (6.48 x 3.00 x 0.30 in) Weight 185 g (6.53 oz) SIM Dual SIM (Nano-SIM, dual stand-by) IP54, dust and splash resistant Display Type IPS LCD, 90Hz, 500 ni
الحالة: Neuf jamais utilisé, المنطقة: ALGER,
سعر : 34 500 دج
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REALME C65 6/128
Network Technology GSM / HSPA / LTE Launch Announced 2024, April 02 Status Available. Released 2024, April Body Dimensions 164.6 x 76.1 x 7.6 mm (6.48 x 3.00 x 0.30 in) Weight 185 g (6.53 oz) SIM Dual SIM (Nano-SIM, dual stand-by) IP54, dust and splash resistant Display Type IPS LCD, 90Hz, 500 ni
الحالة: Neuf jamais utilisé, المنطقة: ALGER,
سعر : 32 990 دج
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SAMSUNG GALAXY A06 4/64
Network Technology GSM / HSPA / LTE Launch Announced 2024, August 16 Status Available. Released 2024, August 22 Body Dimensions 167.3 x 77.3 x 8 mm (6.59 x 3.04 x 0.31 in) Weight 189 g (6.67 oz) Build Glass front, plastic back, plastic frame SIM Single SIM (Nano-SIM) or Dual SIM (Nano-SIM, dual sta
الحالة: Neuf jamais utilisé, المنطقة: ALGER,
سعر : 20 900 دج
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HONOR X6B 6/128
Network Technology GSM / HSPA / LTE Launch Announced 2024, June 13 Status Available. Released 2024, June Body Dimensions 163.6 x 75.3 x 8.4 mm (6.44 x 2.96 x 0.33 in) Weight 192 g (6.77 oz) SIM Nano-SIM + Nano-SIM Display Type TFT LCD, 90Hz, 780 nits (peak) Size 6.56 inches, 103.4 cm2 (~83.9% scree
الحالة: Neuf jamais utilisé, المنطقة: ALGER,
سعر : 29 900 دج
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REALME NOTE 50 4/128GB
Network Technology GSM / HSPA / LTE Launch Announced 2024, January 23 Status Available. Released 2024, January 23 Body Dimensions 167.2 x 76.7 x 8 mm (6.58 x 3.02 x 0.31 in) Weight 186 g (6.56 oz) Build Glass front, plastic frame, plastic back SIM Dual SIM (Nano-SIM, dual stand-by) IP54, dust and
الحالة: Neuf jamais utilisé, المنطقة: ALGER,
سعر : 22 900 دج
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XIAOMI REDMI 14C 6/128GB
Network Technology GSM / HSPA / LTE Launch Announced 2024, August 30 Status Available. Released 2024, August 30 Body Dimensions 171.9 x 77.8 x 8.2 mm (6.77 x 3.06 x 0.32 in) Weight 204 / 207 / 211 g (7.20 oz) Build Glass front, plastic frame, glass back or silicone polymer (eco leather) back SIM Na
الحالة: Neuf jamais utilisé, المنطقة: ALGER,
سعر : 23 900 دج
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HONOR X6B 4/128
Network Technology GSM / HSPA / LTE Launch Announced 2024, June 13 Status Available. Released 2024, June Body Dimensions 163.6 x 75.3 x 8.4 mm (6.44 x 2.96 x 0.33 in) Weight 192 g (6.77 oz) SIM Nano-SIM + Nano-SIM Display Type TFT LCD, 90Hz, 780 nits (peak) Size 6.56 inches, 103.4 cm2 (~83.9% scree
الحالة: Neuf jamais utilisé, المنطقة: ALGER,
سعر : 26 500 دج
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REALME C61 4G 8/256
Network Technology GSM / HSPA / LTE Launch Announced 2024, July Status Available. Released 2024, July 25 Body Dimensions 167.3 x 76.7 x 7.8 mm (6.59 x 3.02 x 0.31 in) Weight 188 g (6.63 oz) Build Glass front, plastic frame, plastic back SIM Dual SIM (Nano-SIM, dual stand-by) IP54, dust and splash
الحالة: Neuf jamais utilisé, المنطقة: ALGER,
سعر : 29 900 دج
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OPPO A60 8/256 GB
Network Technology GSM / HSPA / LTE Launch Announced 2024, April 26 Status Available. Released 2024, April 26 Body Dimensions 165.7 x 76 x 7.7 mm (6.52 x 2.99 x 0.30 in) Weight 186 g (6.56 oz) SIM Dual SIM (Nano-SIM, dual stand-by) IP54, dust and splash resistant Display Type IPS LCD, 90Hz, 950 n
الحالة: Neuf jamais utilisé, المنطقة: ALGER,
سعر : 38 900 دج
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ASUS TUF GAMING Z890-PLUS WIFI
En stock Livraison Gratuite 58W Paiement à la livraison The ASUS TUF GAMING Z890-PLUS WIFI motherboard with Intel socket LGA 1851 and powered by the Intel Z890 Chipset supports Intel Core Ultra Arrow Lake-S processors. Equipped with exclusive ASUS TUF hardware and software features, the ASUS TUF GA
المنطقة: ORAN,
سعر : 79 000 دج
اقتراحات أخرى
جرب هذا الإملاء: sidi (11025) maxbell (5)
