gpu plastic

SAMSUNG GALAXY F55 8/256 5G

Network Technology GSM / HSPA / LTE / 5G Launch Announced 2024, May 17 Status Available. Released 2024, May 27 Body Dimensions 163.9 x 76.5 x 7.8 mm (6.45 x 3.01 x 0.31 in) Weight 180 g (6.35 oz) Build Glass front, silicone polymer (eco leather) back, plastic frame SIM Hybrid Dual SIM (Nano-SIM, du

الحالة: Neuf jamais utilisé, المنطقة: ALGER,

سعر : 52 900 دج

INFINIX SMART 8 8/128

Network Technology GSM / HSPA / LTE Launch Announced 2023, November 09 Status Available. Released 2023, November 09 Body Dimensions 163.6 x 75.6 x 8.5 mm (6.44 x 2.98 x 0.33 in) Weight 184 g (6.49 oz) Build Glass front, plastic back, plastic frame SIM Dual SIM (Nano-SIM, dual stand-by) Display Type

الحالة: Neuf jamais utilisé, المنطقة: ALGER,

سعر : 19 900 دج

VIVO Y03 4/64

Network Technology GSM / HSPA / LTE Launch Announced 2024, March 13 Status Available. Released 2024, March 13 Body Dimensions 163.8 x 75.7 x 8.4 mm (6.45 x 2.98 x 0.33 in) Weight 185 g (6.53 oz) Build Glass front, plastic frame, plastic back SIM Dual SIM (Nano-SIM, dual stand-by) IP54, dust and s

الحالة: Neuf jamais utilisé, المنطقة: ALGER,

سعر : 22 900 دج

XIAOMI REDMI NOTE 13 PRO 4G 8/256

NETWORK Technology GSM / HSPA / LTE LAUNCH Announced 2024, January 15 Status Available. Released 2024, January 15 BODY Dimensions 161.1 x 75 x 8 mm (6.34 x 2.95 x 0.31 in) Weight 188 g (6.63 oz) Build Glass front (Gorilla Glass 5), plastic frame, plastic back SIM Dual SIM (Nano-SIM, dual stand-by)

الحالة: Neuf jamais utilisé, المنطقة: ALGER,

سعر : 54 900 دج

RAIDMAX X606 BLACK 3X ARGB

X606(NOIR) PRODUCT NO. X606TF DIMENSIONS (mm) 460(L) x 210(W) x 482(H) MOTHERBOARD SUPPORT ATX / Micro-ATX / Mini-ITX EXPANSION SLOTS 7 MATERIALS Plastic, Steel, Tempered Glass 3.5″HDD 2 2.5″ HDD 1 I/O Ports USB3.0 x 1, USD2.0 x 1, HD Audio, Power, Reset FAN SUPPORT Front: 120mm x 3 / 140mm x 3 To

المنطقة: ORAN,

سعر : 11 900 دج

RAIDMAX X603 LITE BLACK

Product Description The Raidmax X603 LITE ARGB Gaming Chassis is where functionality coalesces with artistry to create a gaming environment that’s not just about power, but also about prestige. Clad in an understated black, this chassis is a cornerstone for any serious gamer’s setup, supporting a wi

المنطقة: ORAN,

سعر : 15 900 دج

BOITIER RAIDMAX I800

SPECIFICATIONS PRODUCT NAME i800 Product NO. i800TBF (Black) / i800TWF (White) DIMENSIONS 429(L) x 212(W) x 485(H) MOTHERBOARD SUPPORT ATX / Micro-ATX / Mini-ITX EXPANSION SLOTS 7 MATERIALS Plastic, Steel, Tempered Glass 3.5"HDD / 2.5"SSD 2 / 3 I/O Ports USB3.0 x 1, USD2.0 x 2, HD Audio, Power, Rese

المنطقة: BLIDA,

BOITIER RAIDMAX X606 BLACK

PRODUCT NAME X606 PRODUCT NO. X606TBF DIMENSIONS (mm) 460(L) x 210(W) x 482(H) MOTHERBOARD SUPPORT ATX / Micro-ATX / Mini-ITX EXPANSION SLOTS 7 MATERIALS Plastic, Steel, Tempered Glass 3.5"HDD / 2.5"SSD 2 / 1 I/O Ports USB3.0 x 1, USD2.0 x 1, HD Audio, Power, Reset FAN Support Front: 120mm x 3 / 140

المنطقة: ALGER,

REALME NOTE 60 4/128

Network Technology GSM / HSPA / LTE Launch Announced 2024, August 30 Status Available. Released 2024, August 30 Body Dimensions 167.3 x 76.7 x 7.8 mm (6.59 x 3.02 x 0.31 in) Weight 187 g (6.60 oz) Build Glass front, plastic frame, plastic back SIM Dual SIM (Nano-SIM, dual stand-by) IP64, dust and

الحالة: Neuf jamais utilisé, المنطقة: ALGER,

سعر : 26 990 دج

SAMSUNG GALAXY A15 4/128

NETWORK Technology GSM / HSPA / LTE LAUNCH Announced 2023, December 11 Status Available. Released 2023, December 16 BODY Dimensions 160.1 x 76.8 x 8.4 mm (6.30 x 3.02 x 0.33 in) Weight 200 g (7.05 oz) Build Glass front, plastic back, plastic frame SIM Single SIM (Nano-SIM) or Hybrid Dual SIM (Nano-

الحالة: Neuf jamais utilisé, المنطقة: ALGER,

سعر : 36 500 دج