platform wireless

Carte-mère AMD AM5 Gigabyte A620M Gaming X AX Wi-Fi WiFi 6E

➡️➡️ التوصيل إلى 58 ولاية الدفع عند الاستلام ➡️➡️ Livraison 58 wilayas Paiement à la livraison ➡️➡️ البيع فقط عن طريق التوصيل ،للطلب اضغط على زر "طلب" ➡️➡️ ➡️➡️ Vente uniquement par livraison, Pour commander appuyez sur le bouton "Commander" ➡️➡️ ➡️➡️ لأية أسئلة أو معلومات أرسل لنا رسالة ➡️➡️ ➡️➡️ P

Region: ALGER,

CARTE MERE X670 AORUS ELITE AX GIGABYTE

Processeur AMD Socket AM5, support for: AMD Ryzen™ 7000 Series Processors (Please refer "CPU Support List" for more information.) Chipset AMD X670 Mémoire Support for DDR5 8000(OC)/ 7800(OC)/ 7600(OC)/ 7200(OC)/ 7000(OC)/ 6800(OC)/ 6666(OC)/ 6600(OC)/ 6400(O

Region: BATNA,

Price : 63 000 DA

SAMSUNG GALAXY TAB S10 ULTRA 12/256GB WIFI 14.6"

Network Technology GSM / HSPA / LTE / 5G Launch Announced 2024, September 26 Status Available. Released 2024, October 03 Body Dimensions 326.4 x 208.6 x 5.4 mm (12.85 x 8.21 x 0.21 in) Weight 718 g (Wi-Fi), 723 g (5G) (1.58 lb) Build Glass front, aluminum frame, aluminum back SIM Nano-SIM + eSIM (c

Condition: Neuf jamais utilisé, Region: ALGER,

Price : 224 900 DA

SAMSUNG GALAXY S24 FE 8/256

Network Technology GSM / HSPA / LTE / 5G Launch Announced 2024, September 26 Status Available. Released 2024, October 03 Body Dimensions 162 x 77.3 x 8 mm (6.38 x 3.04 x 0.31 in) Weight 213 g (7.51 oz) Build Glass front (Gorilla Glass Victus+), glass back (Gorilla Glass Victus+), aluminum frame SIM

Region: ALGER,

Price : 116 900 DA

SAMSUNG GALAXY S25 12/256 1SIM

Network Technology GSM / CDMA / HSPA / EVDO / LTE / 5G Launch Announced 2025, January 22 Status Available. Released 2025, February 03 Body Dimensions 146.9 x 70.5 x 7.2 mm (5.78 x 2.78 x 0.28 in) Weight 162 g (5.71 oz) Build Glass front (Gorilla Glass Victus 2), glass back (Gorilla Glass Victus 2),

Condition: Neuf jamais utilisé, Region: ALGER,

Price : 171 900 DA

CARTE MERE GIGABYTE B550 AORUS ELITE AX V2

Processeur AMD Socket AM4, support for: AMD Ryzen™ 5000 Series/ Ryzen™ 5000 G-Series/ Ryzen™ 4000 G-Series, Ryzen™ 3000 Series and Ryzen™ 3000 G-Series Processors (Please refer "CPU Support List" for more information.) Chipset AMD B550 Mémoire 4 x DDR4 DIMM sockets supporting up to 128 GB (32 GB sin

Region: ALGER,

SAMSUNG GALAXY S24 FE 8/128 DS

Network Technology GSM / HSPA / LTE / 5G Launch Announced 2024, September 26 Status Available. Released 2024, October 03 Body Dimensions 162 x 77.3 x 8 mm (6.38 x 3.04 x 0.31 in) Weight 213 g (7.51 oz) Build Glass front (Gorilla Glass Victus+), glass back (Gorilla Glass Victus+), aluminum frame SIM

Condition: Neuf jamais utilisé, Region: ALGER,

Price : 122 000 DA

CORSAIR HS55 SURROUND WIRED BLACK

Technical Details Wireless communication technologies ‎Bluetooth Included components ‎Cable Age range (description) ‎Adult Material ‎memory foam Faux Leather Specific uses for product ‎Gaming Recommended product uses ‎Gaming Compatible devices ‎Laptops, Desktops, Gaming Consoles, Telephones, Tablets

Region: ORAN,

Gigabyte arous b550 elite

AMD Socket AM4, support for: AMD Ryzen™ 5000 Series/ Ryzen™ 5000 G-Series/ Ryzen™ 4000 G-Series, Ryzen™ 3000 Series and Ryzen™ 3000 G-Series Processors (Please refer "CPU Support List" for more information.) Chipset AMD B550 Mémoire 4 x DDR4 DIMM sockets supporting up to 128 GB (32 GB single DIMM ca

Region: ORAN,

CARTE MERE GIGABYTE X870 AORUS ELITE WIFI7 ICE

Processeur AMD Socket AM5, support for: AMD Ryzen™ 9000 Series Processors/ AMD Ryzen™ 8000 Series Processors/ AMD Ryzen™ 7000 Series Processors (Go to GIGABYTE's website for the latest CPU support list.) Chipset AMD X870 Mémoire Support for DDR5 8200(OC) / 8

Region: BATNA,