gpu plastic

XIAOMI REDMI 14C 8/256GB

NETWORK Technology GSM / HSPA / LTE LAUNCH Announced 2024, August 30 Status Available. Released 2024, August 30 BODY Dimensions 171.9 x 77.8 x 8.2 mm (6.77 x 3.06 x 0.32 in) Weight 204 / 207 / 211 g (7.20 oz) Build Glass front (Gorilla Glass 3), plastic frame, glass back or silicone polymer (eco le

Condition: Neuf jamais utilisé, Region: ALGER,

Price : 26 900 DA

INFINIX SMART 9 4+4/128

NETWORK Technology GSM / HSPA / LTE LAUNCH Announced 2024, September 23 Status Available. Released 2024, October BODY Dimensions 165.7 x 77.1 x 8.4 mm (6.52 x 3.04 x 0.33 in) Weight 188 g (6.63 oz) Build Glass front, plastic back, plastic frame SIM Nano-SIM + Nano-SIM IP54 dust protected and wate

Condition: Neuf jamais utilisé, Region: ALGER,

Price : 20 900 DA

INFINIX SMART 9 3+3/64

Network Technology GSM / HSPA / LTE Launch Announced 2024, September 23 Status Available. Released 2024, October Body Dimensions 165.7 x 77.1 x 8.4 mm (6.52 x 3.04 x 0.33 in) Weight 188 g (6.63 oz) Build Glass front, plastic back, plastic frame SIM Nano-SIM + Nano-SIM IP54 dust protected and wate

Condition: Neuf jamais utilisé, Region: ALGER,

Price : 17 900 DA

SAMSUNG GALAXY A36 5G 8/128GB VIETNAM

Network Technology GSM / HSPA / LTE / 5G Launch Announced 2025, March 02 Status Available. Released 2025, March 10 Body Dimensions 162.9 x 78.2 x 7.4 mm (6.41 x 3.08 x 0.29 in) Weight 195 g (6.88 oz) Build Glass front (Gorilla Glass Victus+), plastic frame, glass back (Gorilla Glass Victus+) SIM Na

Condition: Neuf jamais utilisé, Region: ALGER,

Price : 64 900 DA

MOTOROLA EDGE 60 12/512GB 5G

NETWORK Technology GSM / HSPA / LTE / 5G LAUNCH Announced 2025, April 24 Status Available. Released 2025, April 25 BODY Dimensions 161.2 x 73.1 x 7.9 mm or 8.2 mm Weight 179 g or 181 g (6.31 oz) Build Glass front (Gorilla Glass 7i), plastic frame, plastic back SIM · Nano-SIM · Nano-SIM + eSIM · Nan

Condition: Neuf jamais utilisé, Region: ALGER,

Price : 77 500 DA

BOITIER GIGABYTE C102 GLASS

Case Form Factor Mid Tower M/B Type Mini ITX / Micro ATX Color Black Materials Steel, Plastic, Glass Dimensions H450x W210x D450 mm (Within ± 1% error) Expansion Slots 5 5.25" Drive Bays None 3.5" Drive Support 2 2.5" Drive Suppor

Region: BATNA,

XIAOMI 15T PRO 5G 12/512 GB

NETWORK Technology GSM / HSPA / LTE / 5G LAUNCH Announced 2025, September 24 Status Available. Released 2025, September 24 BODY Dimensions 162.7 x 77.9 x 8 mm (6.41 x 3.07 x 0.31 in) Weight 210 g (7.41 oz) Build Glass front (Gorilla Glass 7i), aluminum frame, fiber-reinforced plastic back SIM · Nan

Condition: Neuf jamais utilisé, Region: ALGER,

Price : 137 900 DA

XIAOMI REDMI 14C 6/128GB

Network Technology GSM / HSPA / LTE Launch Announced 2024, August 30 Status Available. Released 2024, August 30 Body Dimensions 171.9 x 77.8 x 8.2 mm (6.77 x 3.06 x 0.32 in) Weight 204 / 207 / 211 g (7.20 oz) Build Glass front, plastic frame, glass back or silicone polymer (eco leather) back SIM Na

Condition: Neuf jamais utilisé, Region: ALGER,

Price : 23 900 DA

raidmax x605 4FANS ARGB

PRODUCT NAME RAIDMAX X605 PRODUCT NO. X605TBF (Black) / X605TWF (BLACK) DIMENSIONS (mm) 470(L) x 230(W) x 485(H) MOTHERBOARD SUPPORT E-ATX / ATX / Micro-ATX / Mini-ITX EXPANSION SLOTS 7 MATERIALS Plastic, Steel, Tempered Glass 3.5″HDD / 2.5″SSD 2 / 2 I/O Ports USB3.0 x 1, USB2.0 x 2, HD Audio, Power

Region: BLIDA,

Price : 12 900 DA

ANTEC AX67 ARGB 4FANS BLACK

SPECIFICATIONS main spec Dimensions 405 x 200 x 449mm(DWH) Form Factor Mid Tower Materials Steel+Plastic Mainboard Support ATX, Micro-ATX, ITX Front Access & Controls Power, LED Control Button, 2 x USB 2.0, 1 x USB 3.0, HD-AUDIO Side Panel 4mm Tempered glass Drive Bays Expansion Slots 7 3.5" /2.5" 2

Region: ALGER,

Price : 12 900 DA