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MSI X670E GAMING PLUS WIFI

Chipset AMD X670 CPU Supports AMD Ryzen™ 9000/ 8000/ 7000 Series Desktop Processors Socket AM5 Memory 4x DDR5 UDIMM, Maximum Memory Capacity 256GB Memory Support DDR5 7800+(OC)/ 7600(OC)/ 7400(OC)/ 7200(OC)/ 7000(OC)/ 6800(OC)/ 6600(OC)/ 6400(OC)/ 6200(OC)/ 6000(OC)/ 5800(OC)/ 5600(OC)/ 5400(OC)/ 52

Region: ALGER,

Price : 67 900 DA

MSI X870 GAMING PLUS WIFI

Chipset AMD X870 CPU Supports AMD Ryzen™ 9000/ 8000/ 7000 Series Desktop Processors Socket AM5 Memory 4x DDR5 UDIMM, Maximum Memory Capacity 256GB Memory Support DDR5 8200 - 5600 (OC) MT/s / 5600 - 4800 (JEDEC) MT/s Ryzen™ 9000 Series Processors max. overclocking frequency: • 1DPC 1R Max speed up to

Region: ALGER,

Price : 75 900 DA

GIGABYTE B840M AORUS ELITE AMD AM5 WIFI 6E

The GIGABYTE B840M AORUS ELITE WIFI 6 (more accurately, B840M AORUS ELITE WIFI6E) is a Micro ATX motherboard for AMD Socket AM5 CPUs (Ryzen 7000/8000/9000 series), featuring robust power delivery (10+2+2 VRM), support for fast DDR5 RAM (up to 8200MHz OC), PCIe 4.0, dual M.2 slots with screwless heat

Region: DJELFA,

Price : 52 900 DA

Carte de développement raspberry raspberry pi 4 model B 2GB RAM DP1088557

1.5GHz 64-bit quad-core CPU Available with 2GB RAM 2.4 GHz and 5.0 GHz IEEE 802.11ac wireless, Bluetooth 5.0 2 × USB 3.0 ports ; 2× USB 2.0 ports Raspberry Pi standard 40 pin GPIO header 2 × micro-HDMI ports (up to 4kp60 supported) 2-lane MIPI DSI display port 2-la

Condition: Neuf,

Price : 21 300 DA

Module émetteur-récepteur Bluetooth Robocraze HC06 avec sorties TTL | Module Bluetooth pour cartes compatibles avec Arduino DP1082934

This is HC-06 Bluetooth Module Uses Bluetooth 2.0 protocol for wireless data communication Acts as a slave device Utilizes frequency hopping spread spectrum (FHSS) to avoid interference Enables full duplex transmission Operates on the 2.402 GHz to 2.480 GHz frequency range Easy to int

Condition: Neuf,

Price : 2 050 DA

LAPTOP LENOVO V15 G4 IRU I3-1315U 8Go 256Go SSD 15.6" FHD WIN 11 PRO BLACK AZERTY

PERFORMANCE Processor Intel® Core™ i3-1315U, 6C (2P + 4E) / 8T, P-core 1.2 / 4.5GHz, E-core 0.9 / 3.3GHz, 10MB Graphics Integrated Intel® UHD Graphics Chipset Intel® SoC Platform Memory 8GB Soldered DDR4-3200 Memory Slots One memory soldered to systemboard, one DDR4 SO-DIMM slot, dual-channel capabl

Region: ALGER,

CANON EOS R5 Hybride Mirrorless - 45 MP - 8K Vidéo - Only Body \ Boitier Nu -

✅INFORMATIONS GÉNÉRALES : ✅Désignation : Canon Eos R5 ✅Marque : Canon ✅Modèle : Eos R5 ✅Caractéristiques générales : ✅ Caractéristiques détaillées : Capteur d'image : Type : CMOS 36 × 24 mm Nombre de pixels effectifs : Env. 45 millions de pixels Nombre total de pixels : Env. 47,

Region: ALGER,

Price : 640 000 DA

Speaker E-3090 Wooden Multimedia Digital Speaker

Product Name E-1090 E-3090 Home Theater Sound System Speaker 4D Surround Soundbar Computer Speaker For TV Soundbar Box Subwoofer Stereo Box Power 4Ω 3W * 2 (2" * 2 ) Product size 300*65*65mm Weight 600g Feature AUX / Bluetooth / LED Outer box size 49.5*35.5*59.5cm Packing quantity 30pcs N.W / G.W 1

Region: CONSTANTINE,

Price : 1 750 DA

SAMSUNG GALAXY XCOVER 7 6/128GB

NETWORK Technology GSM / HSPA / LTE / 5G LAUNCH Announced 2024, January 10 Status Available. Released 2024, January 23 BODY Dimensions 169 x 80.1 x 10.2 mm (6.65 x 3.15 x 0.40 in) Weight 240 g (8.47 oz) SIM · Nano-SIM + eSIM · Nano-SIM + Nano-SIM IP68 dust tight and water resistant (immersible up

Condition: Neuf jamais utilisé, Region: ALGER,

Price : 41 900 DA

SAMSUNG GALAXY A57 5G 8/128GB

NETWORK Technology GSM / HSPA / LTE / 5G LAUNCH Announced 2026, March 25 Status Available. Released 2026, April 9 BODY Dimensions 161.5 x 76.8 x 6.9 mm (6.36 x 3.02 x 0.27 in) Weight 179 g (6.31 oz) Build Glass front (Gorilla Glass Victus+), aluminum frame, glass back (Gorilla Glass Victus+) SIM ·

Condition: Neuf jamais utilisé, Region: ALGER,

Price : 82 500 DA