sensors

SAMSUNG GALAXY M36 5G 6/128GB

NETWORK Technology GSM / HSPA / LTE / 5G LAUNCH Announced 2025, June 27 Status Available. Released 2025, July 12 BODY Dimensions 164.4 x 77.9 x 7.7 mm (6.47 x 3.07 x 0.30 in) Weight 197 g (6.95 oz) Build Glass front (Gorilla Glass Victus+), plastic frame, glass back SIM Nano-SIM + Nano-SIM Drop r

Condition: Neuf jamais utilisé, Region: ALGER,

Price : 42 900 DA

Motherboard Gigabyte A520M K V2

Supports AMD Ryzen™ 5000 Series/ Ryzen™ 5000 G-Series/ Ryzen™ 4000 G-Series and Ryzen™ 3000 and Ryzen™ 3000 G-Series Processors Dual Channel ECC/ Non-ECC Unbuffered DDR4, 2 DIMMs PCIe Gen3 x4 M.2 with PCIe NVMe & SATA mode support GbE LAN with Bandwidth Management 8-Channel HD Audio with High Qu

Region: ORAN,

Price : 19 500 DA

XIAOMI REDMI A3X 4/128GB

Network Technology GSM / HSPA / LTE Launch Announced 2024, May 24 Status Available. Released 2024, May 24 Body Dimensions 168.4 x 76.3 x 8.3 mm (6.63 x 3.00 x 0.33 in) Weight 193 g (6.81 oz) Build Glass front (Gorilla Glass 3), glass back, plastic frame SIM Dual SIM (Nano-SIM, dual stand-by) Displa

Condition: Neuf jamais utilisé, Region: ALGER,

Price : 25 900 DA

MB GIGABYTE B650M H Rev.1.2 AMD AM5 DDR5

Care Mere AMD AM5 GIGABYTE B650M H Rev.1.2 PN:9MB65MH-00-G12 **AMD Socket AM5：Supports AMD Ryzen™ 7000 / Ryzen™ 8000 / Ryzen™ 9000 Series Processors **Unparalleled Performance：5+2+2 Phases Digital VRM Solution **Dual Channel DDR5：2*SMD DIMMs with AMD EXPO™ & Intel® XMP Memory Module Support **Su

Region: ALGER,

Price : 28 500 DA

MB GIGABYTE A520M DS3H V2 Rev.1.1 AMD AM4

Carte Mere AD Am4 GIGABYTE A520M DS3H Rev.1.1 **AMD A520 Ultra Durable Motherboard with Digital VRM Solution, GbE LAN, Smart Fan 5 with FAN STOP **Supports AMD Ryzen™ 5000 Series/ Ryzen™ 5000 G-Series/ Ryzen™ 4000 G-Series and Ryzen™ 3000 and Ryzen™ 3000 G-Series Processors **Dual Channel ECC/ No

Region: ALGER,

Price : 19 800 DA

MB GIGABYTE A620M H Rev.1.2 AMD AM5 DDR5

Carte mere AMD AM5 Gigabyte A620M H Rev.1.2 **AMD Socket AM5：Supports AMD Ryzen™ 7000 / Ryzen™ 8000 / Ryzen™ 9000 Series Processors **Unparalleled Performance：5+2+2 Phases Digital VRM Solution **Dual Channel DDR5：2*SMD DIMMs with AMD EXPO™ & Intel® XMP Memory Module Support **SuperSpeed Storage：PCI

Region: ALGER,

Price : 23 900 DA

MB GIGABYTE H410M SH V3 Rev.1.3 intel 10th Gen

Carte mere GIGABYTE H410M SH V3 Rev.1.3 intel 10th Gen **Intel® Ultra Durable Motherboard with Intel® GbE LAN, PCIe Gen3 x4 M.2, HDMI / DVI-D/ D-Sub Ports for Multiple Display, Anti-Sulfur Resistor, Smart Fan 5 **Supports 10th Gen Intel® Core™ Processors **Dual Channel Non-ECC Unbuffered DDR4, 2

Region: ALGER,

Price : 19 500 DA

MOTOROLA G55 8/256GB 5G

NETWORK Technology GSM / HSPA / LTE / 5G LAUNCH Announced 2024, August 29 Status Available. Released 2024, September 06 BODY Dimensions 161.6 x 73.8 x 8.1 mm (6.36 x 2.91 x 0.32 in) Weight 179 g or 182 g (6.31 oz) Build Glass front (Gorilla Glass 5), plastic frame, plastic back or silicone polymer

Condition: Neuf jamais utilisé, Region: ALGER,

Price : 49 900 DA

MOTOROLA G15 4/128GB

NETWORK Technology GSM / HSPA / LTE LAUNCH Announced 2024, December 17 Status Available. Released 2025, February 12 BODY Dimensions 165.7 x 76 x 8.2 mm (6.52 x 2.99 x 0.32 in) Weight 190 g (6.70 oz) Build Glass front (Gorilla Glass 3), plastic frame, silicone polymer back (eco leather) SIM Nano-SIM

Condition: Neuf jamais utilisé, Region: ALGER,

Price : 32 900 DA

MOTOROLA G35 8/256GB 5G

NETWORK Technology GSM / HSPA / LTE / 5G LAUNCH Announced 2024, August 29 Status Available. Released 2024, September 25 BODY Dimensions 166.3 x 76 x 7.8 mm (6.55 x 2.99 x 0.31 in) Weight 188 g or 191 g (6.63 oz) Build Glass front (Gorilla Glass 3), plastic back or silicone polymer (eco leather), pl

Condition: Neuf jamais utilisé, Region: ALGER,

Price : 39 900 DA